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Apollo510B SoC: Ambiq’s Bluetooth LE 5.4 Edge AI Chip

Advanced Connectivity for Edge AI

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The Apollo510B SoC is an ultra-low power system-on-chip (SoC) designed for high-performance AI at the edge. It combines an Arm® Cortex®-M55 processor with Helium™ technology, a dedicated Bluetooth® Low Energy 5.4 radio, graphiqSPOT® 2.0 graphics, and secureSPOT® 3.0 security. Built on Ambiq’s SPOT® platform, Apollo510B targets smartwatches, hearables, smart home devices, health monitoring, industrial sensing, and asset tracking.

Wireless Intelligence Evolved

01

Breakthrough Energy-Efficiency

Achieve breakthrough energy efficiency with the lightning-fast Arm® Cortex®-M55 application processor with Helium™ technology for high-performing AI at the edge.

02

Better with SPOT

Ambiq’s Subthreshold Power Optimized Technology (SPOT) platform optimizes Bluetooth®, security, graphics, voice, AI, and more, giving smart device manufacturers a leading edge in energy efficiency and performance.

03

Effortless Communications

Featuring a dedicated 48 MHz network coprocessor and Bluetooth Low Energy 5.4 radio for seamless low-power connectivity.

04

Always-on Edge AI

Breeze through AI/ML workloads concurrent with complex graphics, and always-on voice and sensor processing at the edge.

Block Diagram Apollo510B

Apollo510B block diagram

Specifications

High-Performance Arm Cortex-M55 Processor with Helium

  • Up to 250 MHz clock frequency
  • Helium (MVE) vector integer, floating point
  • Scalar half, single, and double-precision floating-point
  • Supports TrustZone® architecture security extensions
  • Integrated 64 kB Instruction Cache and 64 kB Data Cache
  • Integrated 768 kB Instr/Data Tightly Coupled Memory (TCM)
  • Memory Protection Unit (MPU)

Bluetooth Low Energy 5.4

  • Direction Finding (single antenna)
  • Long Range
  • Tx Power: Up to +6dBm output power
  • Rx Sensitivity: -94/-97/-103dBm (2Mbps/1Mbps/125kbps)

secureSPOT 3.0 Security Features

  • Arm® TrustZone® technology
  • Secure boot
  • OTP key storage
  • PUF-based identity/sign/verify
  • Secure over-the-air (OTA) updates
  • Key revocation

Ultra-Low Power Memory

  • Up to 4MB of non-volatile memory for code/data
  • 3.75MB of TCM and system RAM for code/data

Ultra-Low Power Interface for On- and Off-Chip Sensors

  • 12-bit ADC, 11 selectable input channels
  • Up to 1.7 MS/s sampling rate
  • Integrated temperature sensor

Ultra-Low Power Flexible Serial Peripherals

  • 1x 2/4/8-bit SPI master interfaces
  • 1x 2/4/8/16-bit SPI master interface supporting 1.2V
  • 7x I2C/SPI masters for peripheral communication
  • I2C/SPI slave for host communications
  • 4x UART modules with FIFOs and flow control
  • 1x USB 2.0 HS/FS device controller
  • 2x SDIO (SD3.0) / eMMC (v4.51)

Display

  • MIPI DSI 1.2 up to 768 Mbps
  • QuadSPI display interface (up to 125MHz DDR)
  • Up to 640 x 480 resolution at 60 FPS
  • 4 layers with alpha blending
  • Frame buffer decompression

graphiqSPOT 2.0 Graphics Features

  • 2D/2.5D GPU with vector graphics (VG) acceleration
  • 96 MHz / 250 MHz operating modes
  • Anti-aliasing hardware acceleration
  • Rasterizer / full alpha blending / texture mapping
  • Texture / frame buffer compression (TSC4, 6, 6A, and 12)
  • Dithering and radial/conical fill support

Audio Processing

  • 1x Low power audio ADC with PGA
  • 1x PDM stereo DMIC interface
  • 2x full-duplex multichannel I²S port (1x with ASRC)

Rich Set of Clock Sources

  • PLL for precise clocking applications
  • 48 MHz and 32.768 kHz Crystal (XTAL) oscillators
  • Low Frequency RC (LFRC) oscillator
  • High Frequency RC (HFRC) oscillator

Power Management

  • Operating range: 1.71-2.2V
  • Single Inductor Multiple Outputs (SIMO) Buck Converter
  • Multiple I/O voltages supported

Applications

  • Smartwatches/bands
  • Smart home devices
  • Body-worn and ambient AI
  • Wireless sensors and industrial edge
  • Smart remotes
  • Patient health monitoring
  • Hearing assist
  • Condition monitoring
  • Factory predictive maintenance
  • Livestock monitoring
  • Asset tracking

Package Options

  • 5.6 x 5.6 x 0.8 mm BGA with 97 GPIO

Ordering Information

  • -20 to +70C: AP510BFA-CBR (Bluetooth Low Energy, BGA)

Apollo510B EVB

Apollo510B EVB

Apollo510B Arm® Cortex®-M55 based SoC in the BGA package (AP510BFA-CBR)

USB Type C connector for power/download/debug (J16)

USB Type C connector for power/data to Apollo510B SoC (J18)

On-board Segger J-Link debugger

Debug-in port (J2) (SWD or ETM)

Three user-controlled LEDs

Two push buttons for application use, plus a reset push button

Power slide switch with LED power indicator

“On-board interfaces:
– MSPI x16 (Hex) PSRAM (AP Memory APS512XXN-AOB4BI-WBRZ)
– SDIO 8 GB eMMC (ISSI IS21EF08G-JCLI)
– High-speed expansion connector
– MikroBUS socket interface”

General purpose male header (J8) for I/O and power access to a shield board

High-speed connector (J7 – QSH-060-01-X-D-A) for interfacing to displays and/or high-speed memory

RF switch/connector (Murata MM8430-2610RA1) for BLE PHY testing

Test points for voltage measurements and jumpers for current measurements

Solder bridge options for power supply flexibility and peripheral access options

RoHS compliant

AP510BEVB Apollo510B EVB StraightAngle 1600x800 1
AP510BEVB Apollo510B EVB RightAngle 1600x800 1
AP510BEVB Apollo510B EVB Layout 1600x800 1
AP510BEVB Apollo510B EVB LeftAngle 1600x800 1
AP510BEVB Apollo510B EVB StraightAngle 1600x800 1
AP510BEVB Apollo510B EVB RightAngle 1600x800 1
AP510BEVB Apollo510B EVB Layout 1600x800 1
AP510BEVB Apollo510B EVB LeftAngle 1600x800 1

Where to Buy

Design Resources

Additional Documentation

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Video Library

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